AEGLIX vulnerability intelligence
CVE-2022-22071
HIGH · CVSS 8.4 · Analyzed
Published: 2022-06-14 · Updated: 2026-06-17 · Source: NVD
Vulnerability overview
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Severity and scoring
- CVSS score
- 8.4 · HIGH
- CVSS version
- 3.1
- CVSS vector
- CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
- Weaknesses
- CWE-416
CVSS measures technical severity; it does not establish whether this vulnerability is being exploited in your environment.
Known exploitation and remediation
Listed in CISA’s Known Exploited Vulnerabilities catalog.
- Affected product
- Qualcomm · Multiple Chipsets
- Added to catalog
- 2023-12-05
- Required action
- Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- CISA remediation due date
- 2023-12-26
CISA deadlines apply to the organizations covered by its directives. Confirm your own remediation requirements.
Verify affected versions and patch availability in the vendor advisory before making changes.
Affected products and versions
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd695_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd888_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx12_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx65_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3910_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3999_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
These are NVD CPE applicability entries. Some products depend on configuration conditions; consult the official record to confirm applicability.
Advisories and references
- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
Patch · Vendor Advisory
- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
Patch · Vendor Advisory
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2022-22071
US Government Resource